RT-Duroid 6035 печатная плата
RT-Duroid 6035 печатная плата, RT 6035 Изготовление печатных плат, RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Кроме того, Rogers advanced filler…
RT/duroid® 5880 печатная плата
oid® 5880 печатная плата, RT5880 PCB board. Alcanta factory produce RT 5880 material Boards from 2 слой в 20 слои. HDI RT5870 materials, RT5880 materials. RT 6002 материалы, Cavtiy PCBs. high quality HDI PCBs, and fast shipping time.
BGA Substrates PCB
BGA Substrates PCB Fabrication. Alcanta PCB has made many 2 слой в 10 layers BGA Substrates PC Board. and the drilling ways are any layers interconnection. high quality and fast shipping time.
Подложки FC-BGA
Подложки FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.For a growing demand for LSIs for…
Мегтрон 7 Поставщик печатных плат
Мегтрон 7 Поставщик печатных плат,Megtron7GN,R-5785(GN)/R-5680(GN),Megtron7GE, R-5785(GE)/R-5680(GE), Ultra-low Loss,Highly Heat Resistant Circuit Board Materials. The ultra-low dielectric constant (Дк) and dissipation factor (Df) make MEGTRON 7 ideal for high speed and large data volumes associated with servers and routers required for 5G. The MEGTRON 7 family, including MEGTRON 7(N), MEGTRON 7(GE) и…
Минимальный след&Gap PCB
Minimum Trace&Gap PCB manufacturer. The smallest clearance between trace to trace or Pads to Pads are 1.4mil(35um). we offer the smallest Pads Pitch with 160um(7.1мил). Such as FCBGA packaging products.
Тел.: +86 (0)755-8524-1496
Электронная почта: info@alcantapcb.com