open-cavities-pcb
Leiterplatte mit offenen Hohlräumen. What is Cavity PCB? Defined as a hole (Cutouts ) in the PCB going from the outer copper layer to an inner copper layer, but not completely through the PCB. The use of cavities in a PCB as a method to reduce the component height or to increase component clearances is a viable technology.
Open Cavity PCBs require a depth-controlled cutout to expose inner layers to air for antenna or component assembly. Die Alcanta PCB-Fabrik produziert viele Arten von Cavity-PCB-Platinen. Hohlräume auf Leiterplatten. Der größte Teil des Designs. Sie müssen einen Haupt-IC einsetzen (Teile) in den Hohlräumen. Ja. Wir können diese Art produzieren Hohlraumbretter mit hoher Qualität. Wir können die Hohlraumplatine daraus herstellen 4 Schicht zu 70 Lagen. Die meisten Hohlräume stammen aus 4 Schicht zu 16 Lagen.
In einem bestimmten Bereich. Für die Hohlraumplatine werden High-Speed-Leiterplattenmaterialien verwendet, Hochfrequenz-PCB-Materialien, Metallmaterialien, FR4-Materialien mit hohem TG, oder andere unterschiedliche PCB-Materialien. Wir können Hohlraumplatten aus allen diesen Materialien herstellen. Gute Qualität, und günstigerer Preis. Wenn Sie diese Art von Leiterplatte mit Hohlräumen entwerfen. wenn Sie Fragen haben. Sie können bei uns nachfragen. Wir helfen Ihnen jederzeit weiter. Es ist keine Zahlung erforderlich. Nur technischer Austausch.
Conventional technology of making PCB cavity
Low-flow PP + controlled depth milling process or inner filling silica gel materials are usually used. Jedoch, there are many control points and complex operation process in the manufacturing process of this kind of stepped/cavity board, which has the following problems.
Deviation:Core board and PP need to be slotted first, then pressed. Laminating is prone to offset and the size of cavity is deformed.
Gum flow:Usually, the slotting size of PP is 0.5mm larger than that of cavity. At this time, the gum flow is serious and the bottom of cavity is overflowing with gum.Increasing the slot of PP to 1.0mm makes the cavity area prone to depression and the upper and lower core boards prone to loss of dielectric layer leading to conduction.
Material breakage:With the development of miniaturization of PCB board, the thickness of board and the depth of cavity tend to be miniaturized. The board is thinner and thinner, and the cavity is shallower and shallower. Using conventional technology to make step cavity, the cavity area after lamination is prone to depression or even rupture.
Solve the problem of material damage:Conventionally, we use lasers to make HDI blind holes, for which we can use laser to make blind cavity. Jedoch, low-energy drilling should be used to ensure that the copper surface at the bottom of the cavity is not harmed.
Solution of gum flow:Conventional prepreg is low-flow, but when using high-frequency materials, PP has a certain flow gum, which cannot be solved by window opening, so it can only be solved by laser removal.
Solving Deviation:Because the core board is pressed directly without slotting, the copper in the cavity position is etched into a light plate, which is subsequently made by laser drilling, the problem of uneven cavity wall caused by deviation is well solved.
Difficulty Analysis:Because of the laser drilling cavity, the arrangement of the inner hole and the setting of laser energy is very important for the cavity. Through the experimental verification of different high frequency material, many practical data have been obtained on the setting of laser energy and the arrangement of laser holes, which fully realizes the machinability and reliability of the cavity.
Wir können viele Arten von Hohlräumen in hochschichtigen Leiterplatten herstellen. Wenn Sie irgendwelche Fragen haben, Nehmen Sie gerne Kontakt mit uns auf info@alcantapcb.com , Wir helfen Ihnen gerne weiter.