buried-and-blind-vias-pcb
プリント基板メーカーとして. Alcanta 印刷回路基板 company offer High multilayer printed circuit board with Buried via and Blind Vias holes. から 4 レイヤーに 90 レイヤー. 私たちは高品質の HDI PCB を生産します. 高速基板配送サービス. そしてさらに安い価格. There are many standard PCB core materials. and there are many especial PCB materials too.
About the Buried via and Blind Vias holes board. we can make the via with 3mil size or 4 ミル サイズ. it’s about 0.075mm and 0.1mm diameter. the circuit line to line spacing are 2.0mil. it’s about 50um. the pads to pads gap are 2.1mil. it’s about 53um gap. If your company are these kinds smaller spacing. we can produce them with high quality.
Some of The Buried and Blind Vias boards lamination info like below. if your circuit lamination are not same. please send us your printed circuit board lamination. Our engineer will help to check it. our Email add: info@alcantapcb.com
