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Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

We are a professional Substrate package technology development Inte, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate for semiconductor packaging, we mainly produce ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate cross section ic package, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. В области современной электроники, packaging substrates are key components of electronic devices and play an important role in facilitating circuit connections, improving performance and…

We are a professional Semiconductor package substrates, we mainly produce ultra-small trace and spacing packaging substrate and PCBs. In the rapidly evolving landscape of the electronics industry, semiconductor packaging substrates have emerged as indispensable catalysts for technological advancement. This article aims to offer a comprehensive exploration of the fundamental concepts…

bt-materials-pcb. we have produced boards with BT material. This material has different thicknesses. Like: 0.1мм. 0.15мм.0.2мм.0.25мм.0.3mm to 1.6mm. We produce the BT PCB with High quality and fast lead time. Материалы из смолы BT обладают превосходными механическими свойствами., термический, и электрические свойства.