أرشيف الأخبار - صفحة 66 ل 101 - تقنية الكانتا(شنتشن)المحدودة - صفحة 66

We have made Quick-turn-circuit-boards. to produce the quick turn boards. we only need 1 أو 2 أيام. the PCB via holes are 0.15mm. line to line spacing is 0.08mm. pcb boards thick is 0.2mm to 3.0mm. pcb copper thick is 35um to 210um. about the pcb soldermask colour. we can…

Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 طبقة ل 18 طبقات. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.

What is the FC BGA Package? FC BGA Package Reference Guide. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 طبقة ل 18 طبقة

Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. مثل: 10 layer Flip-Chip Package Substrates. 12 طبقة. 14 طبقة. أو 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…

Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. لذا. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!

الشركة المصنعة لركيزة الحزمة المتقدمة. لقد استخدمنا العملية التكنولوجية Msap وSap لإنتاج ركائز الحزمة باستخدام مواد Rogers Materials BT, مواد ABF, وأنواع أخرى من المواد. مجموعة الطبقات الرئيسية لمنتجاتنا هي من 4 طبقة ل 18 طبقات. our company asways made the 10…