News Archives - Page 67 of 96 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 67

FC-BGA substrates (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.For a growing demand for LSIs for…

Megtron 7 PCB Supplier,Megtron7GN,R-5785(GN)/R-5680(GN),Megtron7GE, R-5785(GE)/R-5680(GE), Ultra-low Loss,Highly Heat Resistant Circuit Board Materials. The ultra-low dielectric constant (Dk) and dissipation factor (Df) make MEGTRON 7 ideal for high speed and large data volumes associated with servers and routers required for 5G. The MEGTRON 7 family, including MEGTRON 7(N), MEGTRON 7(GE) and…

Minimum Trace&Gap PCB manufacturer. The smallest clearance between trace to trace or Pads to Pads are 1.4mil(35um). we offer the smallest Pads Pitch with 160um(7.1mil). Such as FCBGA packaging products.

Ro4350B Circuits,Ro4350B PCB Supplier, Rogers 4350B PCB fabrication. Dk of 3.48 +/- 0.05, Dissipation factor of 0.0037 at 10 GHz, Fast shipping time. and more cheap price Rogers 4350b PCB Manufacturer.

Rogers 4003C PCB, Ro4003C PCB. Ro4003C Circuits.Material reference: Dk of 3.38 +/- 0.05,Dissipation factor of 0.0027 at 10 GHz. High quality Rogers PCB fabrication. More lower cost. and the shipping time is fast.

Ro4350B PCB, Rogers 4350B PCB Manufacturing. Dk of 3.48 +/- 0.05, Dissipation factor of 0.0037 at 10 GHz, High quality Rogers PCB Supplier. Fast shipping time. and Low cost. we will help you save time.