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FC-BGA Substrates  manufacturer. we have poroduced FC-BGA Substrates  from 4 layer to 14 layers.  when we use  the ABF base  materials with the  Sap  technology. we can produce the substrates with 15um /15um  gap and  trace.   In today's world, electronic devices have become an integral part of our lives. From smartphones…

ABF Substrates Supplier . Smallest gap ABF Substrates  manufacturer from 4 layer to 14 layers.  when we use  the  Sap  technology.  we need to choose  the ABF base  materials to produce the  substrates.  we can produce  10 layer o to 14 layer HDI substrates.  the substrates  gap and  trace are…

ABF Substrates Manufacturer. .We use advanced MSAP and SAP production technology to process and produce high multilayer ABF substrates and FC-BGA substrates. We have made the substrates from 4 layer to 14 layers.

Introduction Printed circuit boards (PCBs) allow you to verify the design functionalities in your prototype. They are easy to fabricate, and you can test your designs and correct any errors as needed before you dedicate your resources to full production. You save a lot of time and money testing out…

Rogers RT/duroid® 5880LZ PCB maker. Dk of 2.00 +/- .04, Low dissipation factor ranging from .0021 to .0027 at 10GHz, Low density of 1.4 gm/cm3, Low Z-axis coefficient of thermal expansion at 40 ppm/°C.

Rogers RT/duroid® 6002 PCB Fabrication. Dielectric constant (Dk) of 2.94 +/- .04, Dissipation factor of .0012 at 10GHz, Low thermal coefficient of Dk at 12 ppm/°C, Low Z-axis coefficient of thermal expansion at 24 ppm/°C.