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FC-BGA Substrates manufacturer. we have poroduced FC-BGA Substrates from 4 strato a 14 strati. when we use the ABF base materials with the Sap technology. we can produce the substrates with 15um /15um gap and trace. In today's world, electronic devices have become an integral part of our lives. From smartphones…

Fornitore di substrati ABF . Smallest gap ABF Substrates manufacturer from 4 strato a 14 strati. when we use the Sap technology. we need to choose the ABF base materials to produce the substrates. Possiamo produrre 10 layer o to 14 layer HDI substrates. the substrates gap and trace are…

Produttore di substrati ABF. .We use advanced MSAP and SAP production technology to process and produce high multilayer ABF substrates and FC-BGA substrates. We have made the substrates from 4 strato a 14 strati.

Introduction Printed circuit boards (PCB) allow you to verify the design functionalities in your prototype. They are easy to fabricate, and you can test your designs and correct any errors as needed before you dedicate your resources to full production. You save a lot of time and money testing out…

Rogers RT/duroid® 5880LZ PCB maker. Dk of 2.00 +/- .04, Low dissipation factor ranging from .0021 A .0027 at 10GHz, Low density of 1.4 g/cm3, Low Z-axis coefficient of thermal expansion at 40 ppm/°C.

Rogers RT/duroid® 6002 Fabbricazione di PCB. Dielectric constant (Non so) Di 2.94 +/- .04, Dissipation factor of .0012 at 10GHz, Low thermal coefficient of Dk at 12 ppm/°C, Low Z-axis coefficient of thermal expansion at 24 ppm/°C.