Rogers RT/duroid® 6002 PCB, RT/duroid® 6002 PCB, RT 6002 PCB

rogers-rt/duroid®-6002-pcb

Rogers RT/duroid® 6002 PCB Fabrication. Dielectric constant (Dk) of 2.94 +/- .04, Dissipation factor of .0012 at 10GHz, Low thermal coefficient of Dk at 12 ppm/°C, Low Z-axis coefficient of thermal expansion at 24 ppm/°C.

RT/duroid 6002 laminates are low loss materials that provide excellent high frequency performance. With excellent mechanical and electrical properties, these materials are reliable for use in multi-layer board constructions. Rogers RT/duroid 6002 laminates are low dielectric constant microwave materials for use in complex microwave structures.

Low loss for excellent high frequency performance
Tight thickness control
In-plane expansion coefficient matched to copper
Low out-gassing; Ideal for space applications
Excellent dimensional stability

RT/duroid®
6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable. The thermal coefficient of dielectric constant is extremely low from -55o
C to+150o
C (-67°F
to 302°F) which provides the designers of filters, oscillators and delay lines the electrical stability needed in today’s demanding applications. A low Z axis coefficient of thermal expansion (CTE) ensures excellent reliability of plated through-holes. RT/duroid 6002 materials have been successfully temperature cycled
(-55o
C to 125o
C [-67°F to 257°F]) for over 5000 cycles without a single via failure. Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coefficient of expansion to copper. This often eliminates double etching to achieve tight positional tolerances. The low tensile modulus (X,Y) greatly reduces the stress applied to solder joints and allows the expansion of the laminate to be constrained by a minimum amount of low CTE metal, (6 ppm/o C) further increasing surface mount reliability.
½ oz. to 2 oz./ft.2 electrodeposited copper, ½ oz. to 1 oz. reverse treated electrodeposited copper or ½ oz. to 2 oz./ ft.2 rolled copper may be specified as cladding on dielectric thicknesses from 0.005” to 0.125” (0.13 to 3.18mm). RT/duroid 6002 laminate is also available clad with aluminum, brass, or copper plates and resistive foils. Applications particularly suited to the unique properties of RT/duroid 6002 material
include flat and non-planar structures such as antennas, complex multi-layer circuits with inter-layer connections, and microwave circuits for aerospace designs in hostile environments. RT/duroid 6002 laminates have Underwriters Laboratories recognition under classification 94V-0 (Vertical Flammability Test).