High Speed package Substrate Manufacturer
High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.
SHDBU Substrates Manufacturer
SHDBU Substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection package substrates from 4 ل 20 طبقات.
High precision packaging substrate Manufacturer
High precision packaging substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other high quality base package substrate or PCB boards materials.
High Frequency package Substrate Manufacturer
High Frequency package Substrate Manufacturer. the Package Substrate will be made with Rogers materials(High Frequency base). or Showa Denko, Ajinomoto High speed materials.
Organic Package Manufacturer
Organic Package Manufacturer. the Package Substrate will be made with BT, روجرز, Showa Denko and Ajinomoto High speed materials. We also offer Organic Package service.
الركيزة العضوية FC BGA الشركة المصنعة
الركيزة العضوية FC BGA الشركة المصنعة. High speed and high frequency material packaging substrate manufacturing.
هاتف: +86 (0)755-8524-1496
بريد إلكتروني: info@alcantapcb.com