Cavity PCB Substrate Manufacturer
Cavity PCB Substrate Manufacturer. Professional Cavity PCB and Embedded component substrates factory. We use advanced embedded production processes.
Flip Chip CSP (FCCSP) Firm
Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 طبقة ل 20 طبقات. we also offer the Flip Chip CSP package service.
What is Ceramic package substrate?
Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 طبقة ل 30 طبقات.
What is a semiconductor BGA substrate?
Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
ما هي الركيزة FC BGA لأشباه الموصلات?
Semiconductor FC BGA substrate quote. يمكننا إنتاج أفضل درجة اهتزاز مع 100um, أفضل أثر أصغر هو 9um.
ما هي الركيزة الصلبة-فليكس BGA?
We are a professional Rigid-flex BGA substrate quote, نحن ننتج بشكل أساسي ركيزة ذات درجة عثرة صغيرة جدًا, ultra-small trace and PCBs.
هاتف: +86 (0)755-8524-1496
بريد إلكتروني: info@alcantapcb.com