Trade News Archives - صفحة 63 ل 94 - تقنية الكانتا(شنتشن)المحدودة - صفحة 63

Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 طبقة ل 18 طبقات. our company asways made the 10…

Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (MSAP) and Semi-Additive Processes (SAP). To do the traces/spacing with 9um/9um FC BGA packaging substrates.These groundbreaking methodologies have revolutionized PCB production, offering unparalleled capabilities that propel the industry to new heights of innovation and efficiency.

FC BGA Packaging Substrate Supplier. We have used the Msap and Sap technology to produce the the smallest Packaging Substrate with 9um gap. and the lines width are 9um too. we can produce the FC BGA Packaging Substrate from 2 طبقة ل 16 طبقات. the best smallest via holes size…

Flip Chip Package Substrate suppliers.We have used the Msap and Sap technology to produce the Flip Chip Package Substrates from 4 لام ل 16 طبقات. قاعدة الركائز(جوهر) المواد هي المواد الأساسية BT. المواد الأساسية ABF. مواد عالية التردد وعالية السرعة. وغيرها. Our company offer high quality…

Flip Chip Packaging Substrate Manufacturing. 90% of our production equipments were purchased in Japan. We use advanced manufacturing equipment to produce ultra-small spacing substrates. Such as: 10 layer Package Substrates. 12 Layer Package Substrates. 18 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a…

Flip-Chip Package Substrate manufacturers. FC BGA Package Substrate Suppliers. We have made ABF base Package Substrates from 4 طبقة ل 18 طبقات. Ultra-small line width/line spacing with 9um/ 9um. and small size BGA pads. and More bigger than 20um line width and line spacing will be easier to produce. we…