Trade News Archives - صفحة 63 ل 94 - تقنية الكانتا(شنتشن)المحدودة - صفحة 63

Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. لذا. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!

الشركة المصنعة لركيزة الحزمة المتقدمة. لقد استخدمنا العملية التكنولوجية Msap وSap لإنتاج ركائز الحزمة باستخدام مواد Rogers Materials BT, مواد ABF, وأنواع أخرى من المواد. مجموعة الطبقات الرئيسية لمنتجاتنا هي من 4 طبقة ل 18 طبقات. our company asways made the 10…

Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (MSAP) and Semi-Additive Processes (ساب). To do the traces/spacing with 9um/9um FC BGA packaging substrates.These groundbreaking methodologies have revolutionized PCB production, offering unparalleled capabilities that propel the industry to new heights of innovation and efficiency.

FC BGA Packaging Substrate Supplier. We have used the Msap and Sap technology to produce the the smallest Packaging Substrate with 9um gap. and the lines width are 9um too. we can produce the FC BGA Packaging Substrate from 2 طبقة ل 16 طبقات. the best smallest via holes size…

Flip Chip Package Substrate suppliers.We have used the Msap and Sap technology to produce the Flip Chip Package Substrates from 4 لام ل 16 طبقات. قاعدة الركائز(جوهر) المواد هي المواد الأساسية BT. المواد الأساسية ABF. مواد عالية التردد وعالية السرعة. وغيرها. Our company offer high quality…

Flip Chip Packaging Substrate Manufacturing. 90% of our production equipments were purchased in Japan. We use advanced manufacturing equipment to produce ultra-small spacing substrates. مثل: 10 layer Package Substrates. 12 Layer Package Substrates. 18 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a…