Trade News Archives - صفحة 66 ل 94 - تقنية الكانتا(شنتشن)المحدودة - صفحة 66

Rogers Ro4000 PCB Manufacturing, RO4000® LoPro® Series/High Frequency Circuit Fabrication. Cavity Rogers PCBs. HDI PCB and Rigers-Flex PCB fabrication.

Panasonic Megtron PCB Fabrication ,Megtron 6 ثنائي الفينيل متعدد الكلور, Megtron 7, Megtron 8 ثنائي الفينيل متعدد الكلور, Low Loss High Speed Cavity PCB Fabrication , ROGERS RT5880 Fabrication, ROGERS RT6002 Fabrication. ROGERS RO3003 RO3010 RO4350 RO4850 PCB Manufacturer, Rigid-Flex with HDI PCB Manufacturer.

RT-Duroid 6035 ثنائي الفينيل متعدد الكلور, RT 6035 تصنيع ثنائي الفينيل متعدد الكلور, RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. بالإضافة إلى ذلك, Rogers advanced filler…

oid® 5880 ثنائي الفينيل متعدد الكلور, RT5880 PCB board. Alcanta factory produce RT 5880 material Boards from 2 طبقة ل 20 طبقات. HDI RT5870 materials, RT5880 materials. RT 6002 مواد, Cavtiy PCBs. high quality HDI PCBs, and fast shipping time.

BGA Substrates PCB Fabrication. Alcanta PCB has made many 2 طبقة ل 10 layers BGA Substrates PC Board. and the drilling ways are any layers interconnection. high quality and fast shipping time.

ركائز FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.For a growing demand for LSIs for…