Trade News Archives - صفحة 66 ل 94 - تقنية الكانتا(شنتشن)المحدودة - صفحة 66

RT-Duroid 6035 ثنائي الفينيل متعدد الكلور, RT 6035 تصنيع ثنائي الفينيل متعدد الكلور, RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. بالإضافة إلى ذلك, Rogers advanced filler…

oid® 5880 ثنائي الفينيل متعدد الكلور, RT5880 PCB board. Alcanta factory produce RT 5880 material Boards from 2 طبقة ل 20 طبقات. HDI RT5870 materials, RT5880 materials. RT 6002 materials, Cavtiy PCBs. high quality HDI PCBs, and fast shipping time.

BGA Substrates PCB Fabrication. Alcanta PCB has made many 2 طبقة ل 10 layers BGA Substrates PC Board. and the drilling ways are any layers interconnection. high quality and fast shipping time.

ركائز FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.For a growing demand for LSIs for…

Megtron 7 مورد ثنائي الفينيل متعدد الكلور,Megtron7GN,R-5785(GN)/R-5680(GN),Megtron7GE, R-5785(GE)/R-5680(GE), Ultra-low Loss,Highly Heat Resistant Circuit Board Materials. The ultra-low dielectric constant (Dk) and dissipation factor (Df) make MEGTRON 7 ideal for high speed and large data volumes associated with servers and routers required for 5G. The MEGTRON 7 family, including MEGTRON 7(N), MEGTRON 7(GE) and…

Minimum Trace&Gap PCB manufacturer. The smallest clearance between trace to trace or Pads to Pads are 1.4mil(35واحد). we offer the smallest Pads Pitch with 160um(7.1ميل). Such as FCBGA packaging products.