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ceramic-pcb-fabrication

Ceramic プリント基板の製造. Addressing the unique challenges of satellite power supply design, curamik® ceramic substrates excel in demanding applications that require a long lifetime, high reliability and robustness. Si3N4 ceramic substrates, for example, carry higher currents and provide higher voltage isolation. They operate over a wide temperature range. 加えて, the different metal layers are combined hermetically using the curamik bonding process. We are the Ceramic PCB manufacturer in China.

In space, malfunction or failure as that may jeopardize an entire mission as power electronics cannot be repaired or replaced. Radiation and the absence of atmosphere and gravity make it necessary to use radiation-hardened components that dissipate heat by conduction and radiation only. Special provisions are required to prevent damage and provide reliable, long-term, unattended operation when it comes to designing how satellites are powered.

PCB Curamik® Ceramic Substrates Manufacturer
PCB Curamik® Ceramic Substrates Manufacturer

The high heat conductivity, along with the high heat capacity and thermal spreading of the thick copper cladding, makes curamik substrates indispensable to power electronics, particularly for mission-critical applications like satellite power management.

curamik® Performance

  • Siベース3N4 セラミック、活性金属ろう付けで製造 (と) プロセス
  • 寿命が長い用途に使用される, 高い電力密度と堅牢性が必要
  • の熱伝導率を提供します。 90 W/m K @ 20°C
  • で利用可能 6 厚さの組み合わせ
  • のCTE 2.5 ppm/K @ 20°C – 300℃

curamik® Power

  • アル23 provides best price-performance ratio
  • Offers sufficient thermal and mechanical properties for the most common applications
  • の熱伝導率を提供します。 24 W/m K @ 20°C
  • さまざまな厚さの組み合わせが利用可能
  • のCTE 6.8 ppm/K @ 20°C – 300℃

curamik® Power Plus

  • HPS substrates provide enhanced robustness through Zr doped Al23 ceramics
  • Used in medium power output applications
  • の熱伝導率を提供します。 26 W/m K @ 20°C
  • さまざまな厚さの組み合わせが利用可能
  • のCTE 7.1 ppm/K @ 20°C – 300℃

curamik® Thermal

  • Based on AlN ceramics and combines excellent thermal conductivity with good mechanical stability
  • Used in very high operational voltage and power density applications
  • の熱伝導率を提供します。 170 W/m K @ 20°C
  • さまざまな厚さの組み合わせが利用可能
  • のCTE 4.7 ppm/K @ 20°C – 300℃

ご質問がございましたら, お気軽にお問い合わせくださいinfo@alcantapcb.com , 喜んでお手伝いさせていただきます。

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