IC Substrates PCB, IC Substrates, BGA Substrates, 基板

ic-substrates-pcb

IC Substrates Fabrication. IC Substrates PCB made in China. Fast lead time. High quality and more cheap price. Alcanta PCB factory offer IC Substrates and BGASubstrates PCBs from 2 レイヤーに 14 leyers.

What is IC substrate?

IC substrate (also known as IC package substrate) is a key special basic material used in advanced packaging, which is used to package bare IC (integrated circuit) chips. IC substrate acts as the connection between IC chip and PCB through a conductive network of wires and holes. IC packaging substrate is developed on the basis of HDI / BUM board, or IC packaging substrate is HDI / BUM board with higher density.IC is an intermediate product, which has the following functions,Capture semiconductor IC chip,Internal wiring for connecting chip and PCB.

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Alcanta PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip-chip methods.With the rapid development of BGA (ball grid array) and CSP (chip level package) and other new ICs, IC substrate has been booming, these ICs need new packaging substrate. As one of the most advanced PCB (printed circuit board), IC substrate PCB, along with any layer of HDI PCB and flexible rigid PCB, has explosive growth in popularity and application. Now it is widely used in Telecom and electronic updates.

The birth of IC substrate:Traditional integrated circuit (IC) packaging uses a lead frame as the substrate of IC conduction line and supporting IC, connecting pins on both sides or around the lead frame, such as a two-sided pin flat package, four side pin flat package, and so on. When the number of pins is not too much, this packaging method can also meet the requirements. With the development of semiconductor technology, the characteristic size of IC is shrinking and the integration degree is improving. The corresponding IC package is developing towards the direction of ultra multi-pin, narrow pitch, and ultra miniaturization. The traditional lead package has been unable to meet the requirements. In the 1990s, a ball grid array (BGA), chip-scale package (CSP), and other new IC high-density packaging methods began to appear, so an IC substrate PCB emerged.