News Archives - Page 71 of 99 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 71

FCBGA package&FCBGA Substrate,Flip-chip package substrate, we have made the ball Pitch 160um(6.3mil). laser via drill size 70um(2.75mil). and 25um(1mil) for the laser via copper ring. the pad to pad gap are 30um(1.2mil). Advanced FCBGA package substrate technology.

High end PCB Manufacturer. High end HDI PCB Factory. High precision circuit board production. We offer The High end HDI PCB boards from 4 Layer to 100 layers. Advanced production technologies.High quality grade!

Backdrilling PCB Fabrication, Back drilling HDI PCB board Manufacturing. Back drilling (a.k.a controlled depth drilling or CDD) involves using a drill bit slightly larger in diameter than the PTH to remove the conductive plating or stub from the hole. In practice this is achieved by re-drilling the PTH down to…

Ultrathin Bluetooth PCB Fabrication. Smallest size Bluetooth Circuits Manufacturing. Ultrathin Multilayer Bluetooth PCB manufacturers. Ultrathin Bluetooth PCB. Low cost and High quality.

Ceramic Substrate PCB Fabrication. Ceramic Multilayer PCB Manufacturing, Ceramic substrate refers to a special process board where copper foil is directly bonded to the surface (single side or double side) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. Compared with traditional FR-4 or aluminum substrate, the…

Megtron7GE Multilayer PCB Fabrication.R-5785(GE) & R-5680(GE) PCB Fabrication. and R5785(GN)&R5680(GN) PCB Manufacturing. Alcanta PCB company offer Megtron7 series circuit board with Quality grade IPC Class 3. the PCB quality is perfect! Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON7 | R-5785(GN), R-5785(GE), R-5785. We have used these…