Trade News Archives - Page 64 of 94 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 64

FC-BGA Substrates  manufacturer. we have poroduced FC-BGA Substrates  from 4 layer to 14 layers.  when we use  the ABF base  materials with the  Sap  technology. we can produce the substrates with 15um /15um  gap and  trace.   In today's world, electronic devices have become an integral part of our lives. From smartphones…

ABF Substrates Supplier . Smallest gap ABF Substrates  manufacturer from 4 layer to 14 layers.  when we use  the  Sap  technology.  we need to choose  the ABF base  materials to produce the  substrates.  we can produce  10 layer o to 14 layer HDI substrates.  the substrates  gap and  trace are…

ABF Substrates Manufacturer. .We use advanced MSAP and SAP production technology to process and produce high multilayer ABF substrates and FC-BGA substrates. We have made the substrates from 4 layer to 14 layers.

Rogers RT/duroid® 5880LZ PCB maker. Dk of 2.00 +/- .04, Low dissipation factor ranging from .0021 to .0027 at 10GHz, Low density of 1.4 gm/cm3, Low Z-axis coefficient of thermal expansion at 40 ppm/°C.

Rogers RT/duroid® 6002 PCB Fabrication. Dielectric constant (Dk) of 2.94 +/- .04, Dissipation factor of .0012 at 10GHz, Low thermal coefficient of Dk at 12 ppm/°C, Low Z-axis coefficient of thermal expansion at 24 ppm/°C.

Antenna PCB Manufacturing. Antenna Rogers RT/duroid 5880 high frequency PCBs. Low dielectric constant (Dk 2.2) . Dissipation factor of .0009 at 10GHz. and Low moisture absorption. The Antenna PCB was made with High Frequency materials.