embedded-copper-coin-pcb
العملة النحاسية المدمجة PCB هي العملة النحاسية المضمنة في تجويف أو فتحة PCB بعد التوجيه ويتم تعدينها عند الانتهاء من تصفيح PCB. ثنائي الفينيل متعدد الكلور والعملة النحاسية متصلان بإحكام.
ثنائي الفينيل متعدد الكلور Embedded Copper Coin.With the development of new generation information technology, energy saving and new energy vehicles, electric power equipment,الفضاء والفضاء الآخر, the solution of heat dissipation problem is imminent. في الوقت الحالي, there are many ways to solve the problem of PCB heat dissipation, such as dense heat dissipation hole design, thick copper foil circuit, metal-based (جوهر) بناء, embedded copper coindesign, copper-based convex design, high thermal conductivity materials and so on. Embedding copper in PCB directly is one of the effective ways to solve the problem of heat dissipation.
In the PCB Pressure layer center. just a parts need to do the copper coin. it’s ok. we can prdouce them with high quality. the pcb boards layer from 4 طبقة ل 90 طبقات. we can use this technology. No any questions. For the technical detail. Please email to us: info@alcantapcb.com
Embedded copper printed circuit boards (مركبات ثنائي الفينيل متعدد الكلور) have the characteristics of high thermal conductivity, high heat dissipation and space saving,which can effectively solve the heat dissipation problem of high-power electronic components.
The Embedded copper printed circuit boards. We can produce the Copper base(جوهر) thickness from 0.1mm to 7.0mm. The 7.0mm copper thick is the best Thickest material.
And We can produce Embedded copper base PCB. في أثناء. we can produce other kinds Embedded PCB. يحب: Embedded copper core with Cavities. the PCB made with Buried and Blind Vias, الهجينة & العوازل المختلطة, الحفر الخلفي, التحكم في العمق والحفر. and other especial design. we offer high quality PCB with IPC Class II and IPC Class III. سوف يكون ثنائي الفينيل متعدد الكلور صفر عيب. الجودة مثالية! we have many especial core materials in the warehouse.
إذا كان لديك أي أسئلة, فلا تتردد في الاتصال بنا info@alcantapcb.com , سنكون سعداء بمساعدتك.
أهلاً,
We are interested in your buried copper coin technology and have a few questions I am hoping you can help with.
1) How to you handle the gap between the routing and coin edge. Does this result in an air gap?
2) How do you handle thermal expansion/contraction issues causing the coin to become dislodged?
3) How do you handle thickness tolerance of the FR4 stackup versus the coin?
4) Can you make a 2 layer with coin stackup and how would this compare cost wise to a 4 layer with coin stackup?
أطيب التحيات,
Shane