RF35 PCB fabrication. We are the PCB manufacturer for Taconic PCB,RF-35 PCB,microwave PCB ,High Frequency PCB, which price is favorable and the product is guaranteed. We offer Hybrids & Mixed Dielectrics PCB. the PCB quality will be zero defect.
RF-35 is an organic-ceramic laminate in the ORCER family of Taconic products. It is based on woven glass reinforcement. RF-35 is a result of Taconic’s expertise in both ceramic fill technology and in coated PTFE fiberglass.RF-35 is the best choice for low cost, high volume commercial microwave and radio frequency applications. And excellent peel strength for 1/2 ounce and 1 ounce copper (even in comparison to standard epoxy materials), a critical aspect whenever rework is required. And ultra low moisture absorption rate and low dissipation factor minimize phase shift with frequency.
(1) low cost;
(2) Excellent peel strength;
(3) Extraordinary low loss factor;
(4) low water absorption rate;
(5) Enhanced surface smoothness.
(1) power amplifier;
(2) filters and connectors;
(3) Passive components.
1)RF-35 is an organic-ceramic laminate material in the ORCER of TACONIC products.
2)It is a reinforced glass material based on woven glass cloth, and a combination of TACONIC’s ceramic filling technology and glass fiber coated PTFE technology.
3)RF-35 is the best choice for low cost, high volume commercial microwave and wireless frequency applications.
3)RF-35 of 1/20Z and 10Z copper foil boards, even with standard epoxy materials, have excellent peel strength and provide rework at any time.
4)The glass transition temperature of RF -35 exceeds 315 ℃.
5)The ultra-low water absorption and low loss factor of RF-35 minimizes phase shift in the frequency range of use.
6)The dimensional stability of RF-35 is due to the use of woven glass cloth in its design development.
7)RF-35 laminate material, generally with single or double-sided 1/20Z, 10Z and 20Z thickness of electrolytic copper foil. Different sizes of sheets can be selected according to requirements.
8)For the RF-35 microwave material, the relationship between the thermal expansion rate in the Z-axis direction and the temperature is shown in the figure below:
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