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Company News Archives - Page 63 of 86 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 63

  • Panasonic Megtron Series PCB

    Panasonic Megtron Series PCB

    Megtron7N,Megtron7, Megtron6, Megtron4, Megtron2 materials,We offer Megtron series materials PCB from 2 layer to 40 layers. Ultra-low transmission loss Highly heat resistant Multi-layer. Laminate R-5775(N) Prepreg R-5670(N), Laminate R-5775 Prepreg R-5670, Laminate R-5785 Prepreg R-5680,Properties · Transmission loss performance Ranking in MEGTRON series. Panasonic Megtron Series PCB Manufacturer.
  • Minimum Thickness PCB

    Minimum Thickness PCB

    Minimum Thickness PCB(0.05mm to 0.1mm), Final thin PCB. the Thinnest PCB.Lowest Spacing PCB Manufacture((1.5mil to 2.5mil).We offer high quality PCB from 2 layer to 30 layers. Fast lead time. and More cheaper price.
  • Minimum Spacing PCB

    Minimum Spacing PCB

    Minimum Spacing PCB Fabrication. Alcanta offer the Minimum spacing PCB boards. We have produced the smallest spacning pcb circuit board. the distance between the pads and the pads. we made them with 30um(1.2mil), 40um(1.6mil), 50um(2.0mil). 60um, 70um. the gap tolerance are +/-10um.
  • MW400 PCB

    MW400 PCB

    MW400 PCB Fabrication. METEORWAVE 4000 Manufacturer. Ultra Low Loss, Very High Reliability PCB Material.Laminate Part Number: Meteorwave 4000 L. Prepreg Part Number: Meteorwave 4000 P. We produce products with zero defects. the PCB quality are perfect!
  • PTFE Teflon PCB

    PTFE Teflon PCB

    PTFE Teflon PCB, PTFE-Like PCB, High quality PTFE Teflon materials circuit board. and Ptfe-like base materials PC boards. we have made the PCB with Advanced Technologies. PTFE (Polytetrafluoroethylene) is the scientific name for a very well-known product, even outside the engineering community; DuPont's trademarked Teflon has applications extending far beyond…
  • BGA Packages

    BGA Packages

    A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom…