Global Semiconductor Substrate Manufacturer
Global Semiconductor Substrate Manufacturer. We use advanced Msap and Sap technology to manufacturing High multilayer interconnection package substrates.
CPCORE Structure Manufacturer
CPCORE Structure Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 4 to 18 طبقات.
FC-CSP Substrates Manufacturer
FC-CSP Substrates Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other types base materials.
High Speed package Substrate Manufacturer
High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.
SHDBU Substrates Manufacturer
SHDBU Substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection package substrates from 4 to 20 طبقات.
High precision packaging substrate Manufacturer
High precision packaging substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other high quality base package substrate or PCB boards materials.
هاتف: +86 (0)755-8524-1496
بريد إلكتروني: info@alcantapcb.com