Flip Chip CSP (FCCSP) Firm
Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 طبقة ل 20 طبقات. we also offer the Flip Chip CSP package service.
What is Ceramic package substrate?
Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 طبقة ل 30 طبقات.
What is a semiconductor BGA substrate?
Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
ما هي الركيزة FC BGA لأشباه الموصلات?
Semiconductor FC BGA substrate quote. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
ما هي الركيزة الصلبة-فليكس BGA?
We are a professional Rigid-flex BGA substrate quote, نحن ننتج بشكل أساسي ركيزة ذات درجة عثرة صغيرة جدًا, ultra-small trace and PCBs.
What is Rigid-Flex Packaging Substrate?
We are a professional Rigid-flex packaging substrate quote supplier, نحن ننتج بشكل أساسي ركيزة ذات درجة عثرة صغيرة جدًا, أثر صغير جدًا.
هاتف: +86 (0)755-8524-1496
بريد إلكتروني: info@alcantapcb.com