أرشيف الأخبار - صفحة 60 ل 101 - تقنية الكانتا(شنتشن)المحدودة - صفحة 60

Packaging Substrate. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 ل 18 طبقات,

Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. عملية إنتاج الركيزة التعبئة والتغليف المتقدمة والتكنولوجيا.

We are a professional Substrate package technology development Inte, نحن ننتج بشكل أساسي ركيزة ذات درجة عثرة صغيرة جدًا, ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate for semiconductor packaging, we mainly produce ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate cross section ic package, نحن ننتج بشكل أساسي ركيزة ذات درجة عثرة صغيرة جدًا, ultra-small trace and spacing packaging substrate and PCBs. في مجال الإلكترونيات الحديثة, packaging substrates are key components of electronic devices and play an important role in facilitating circuit connections, improving performance and…

We are a professional Semiconductor package substrates, we mainly produce ultra-small trace and spacing packaging substrate and PCBs. In the rapidly evolving landscape of the electronics industry, semiconductor packaging substrates have emerged as indispensable catalysts for technological advancement. This article aims to offer a comprehensive exploration of the fundamental concepts…