What is a Flip Chip Package Substrate?
Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.
What is a Substrate package technology development Inte ?
We are a professional Substrate package technology development Inte, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.
What is the substrate in a semiconductor package?
We are a professional Substrate for semiconductor packaging, we mainly produce ultra-small trace and spacing packaging substrate and PCBs.
Why is a substrate cross-section important in IC design?
We are a professional Substrate cross section ic package, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. In the field of modern electronics, packaging substrates are key components of electronic devices and play an important role in facilitating circuit connections, improving performance and…
What is a semiconductor package substrate?
We are a professional Semiconductor package substrates, we mainly produce ultra-small trace and spacing packaging substrate and PCBs. In the rapidly evolving landscape of the electronics industry, semiconductor packaging substrates have emerged as indispensable catalysts for technological advancement. This article aims to offer a comprehensive exploration of the fundamental concepts…
BT Materials PCB
bt-materials-pcb. we have produced boards with BT material. This material has different thicknesses. Like: 0.1mm. 0.15mm.0.2mm.0.25mm.0.3mm to 1.6mm. We produce the BT PCB with High quality and fast lead time. BT resin materials have excellent mechanical, thermal, and electrical properties.
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